Hanmi Semiconductor makes Computex debut, targeting global AI supply chain

Hanmi Semiconductor made its Computex debut in Taiwan, targeting the global AI semiconductor supply chain. The company is betting on its TC Bonder equipment for HBM production and next-generation 2.5D packaging tools to expand its foothold in the AI semiconductor back-end process market.

Hanmi Semiconductor announced Wednesday that it participated in Computex 2026, which ran June 2–5 at the Taipei Nangang Exhibition Center and the Taiwan World Trade Center in Taipei.

Computex is an ICT trade show held annually in Taipei since 1981. Originally centered on PCs and consumer electronics, it has grown into a major venue where global technology companies — including Nvidia, AMD and Intel — share the latest trends in AI semiconductors, servers, high-performance computing and packaging technology.

This marks Hanmi Semiconductor's first participation in Computex. The move comes as HBM and advanced packaging equipment have become increasingly critical within the AI semiconductor supply chain, and the company aims to showcase its technology to global customers and partners.

At the exhibition, Hanmi Semiconductor unveiled the TC Bonder 4, designed for HBM4 production, along with the Wide TC Bonder for next-generation HBM manufacturing. The TC Bonder is regarded as a key piece of equipment that vertically stacks and bonds DRAM dies in the HBM production process.

The Wide TC Bonder is designed to handle the trend toward larger DRAM die sizes in next-generation HBM production. A wider die area allows for more through-silicon vias and I/O connections, which is advantageous for expanding memory capacity and bandwidth. As competition among AI accelerators intensifies around high-capacity, high-bandwidth HBM, the importance of related equipment continues to grow.

Hanmi Semiconductor also put its 2.5D packaging equipment for AI semiconductors in the spotlight. The company introduced the 2.5D TC Bonder 40 and 2.5D TC Bonder 120, which integrate multiple chips — including GPUs, CPUs and HBM — onto a silicon interposer in a single package. The 2.5D packaging technology is drawing attention as a key method for improving data transfer efficiency between compute chips and memory in AI semiconductors.

Hanmi Semiconductor is also accelerating its expansion within the global AI semiconductor supply chain. The company is pursuing the establishment of a local subsidiary, Hanmi USA, in San Jose, California, by the end of this year. San Jose sits at the heart of Silicon Valley, home to Nvidia, AMD and other leading semiconductor and AI companies. The company plans to use the local presence to strengthen customer support and technology collaboration globally.

This year's Computex drew keynote addresses from prominent figures across the global AI semiconductor industry, including Nvidia CEO Jensen Huang, AMD CEO Lisa Su, and representatives from Intel and Marvell. Organizers expected some 1,500 companies to participate, with 6,000 booths in operation and more than 80,000 visitors from over 150 countries attending the show.

"Computex has become a gathering place for exchanging innovative technologies across the global hardware supply chain and infrastructure — from AI chipset design and packaging to physical AI and finished products," a Hanmi Semiconductor official said. "By showcasing our TC Bonder and next-generation equipment at the center of the AI semiconductor world, we aim to strengthen our leadership in the global market."