KCC targets EV, AI data center markets with power semiconductor material push

KCC said Sunday it participated in PCIM Expo & Conference 2026 in Nuremberg, Germany, where it showcased its power semiconductor material technology.

PCIM is a specialized power electronics exhibition covering the latest technology and products in power electronics, intelligent motion, renewable energy and energy management. KCC displayed key power semiconductor materials at the show, including ceramic substrates, EMC (semiconductor encapsulant) and thermal silicone. The company said it plans to expand the application of its power semiconductor materials beyond electric vehicles into AI data centers to meet growing demand for high-performance power semiconductor materials.

KCC's silicon materials subsidiary Momentive also participated in the exhibition. The two companies jointly presented ceramic substrates, EMC and silicone materials used in power semiconductors and power modules, highlighting their combined capacity to supply integrated material solutions.

The flagship exhibit was an AMB (Active Metal Brazing) ceramic substrate. The AMB substrate enhances bonding strength between copper circuits and ceramics to achieve high thermal conductivity and mechanical durability. It can be applied to electric vehicle inverters and high-output power modules.

Through the exhibition, KCC expanded its contacts with global semiconductor and automotive component manufacturers. The company said its ability to supply ceramic substrates, EMC and silicone materials together emerged as a key differentiator in discussions with prospective customers.

"PCIM 2026 was an opportunity to introduce KCC's power semiconductor material technology and Momentive's silicone material strengths to global customers," a KCC official said. "We will continue to expand the material solutions our customers need in line with demand for high-performance power semiconductors."