Hanmi Semiconductor launches 2.5D TC Bonder 40 for AI system chips

Hanmi Semiconductor is expanding its lineup of 2.5D packaging equipment for AI system chips. The move extends the company's reach beyond TC bonders for HBM into the system semiconductor packaging equipment market needed for AI chip production.

Hanmi Semiconductor announced Tuesday the launch of the 2.5D TC Bonder 40, new equipment supporting 2.5D packaging for AI semiconductors, which it will supply to global foundry and outsourced semiconductor assembly and test companies.

The 2.5D TC Bonder 40 is designed specifically for the chip-on-wafer process in CoWoS packaging. It handles dies ranging from ultra-small 3x3mm to extra-large 40x40mm, making it suited for AI semiconductor die packaging processes that require precision bonding.

Hanmi Semiconductor released the FC Bonder 75 last year and followed up with the FC Bonder 3.5 on June 26. The addition of the 2.5D TC Bonder 40 further strengthens the company's 2.5D packaging equipment lineup for AI system chips. The company said it plans to use the new product to meet customer demand for extra-large die and multi-chip integration processes.

2.5D packaging has emerged as a core process in high-performance computing and AI semiconductors after global technology companies including Nvidia, AMD, Broadcom, Marvell and Apple adopted it for AI chip production. Leading technologies in the space include TSMC's CoWoS and Intel's EMIB, with the field continuing to evolve toward approaches such as CoPoS and 3D SoIC.

"Building on the technology that secured our position as the global No. 1 in TC bonders for HBM in the AI memory market, we plan to expand our presence in the system semiconductor 2.5D packaging market as well," a Hanmi Semiconductor official said. "We will build out our semiconductor equipment portfolio in line with market demand and achieve sustained sales growth."