Hanmi Semiconductor unveils AI chip 2.5D packaging equipment at Semicon Taiwan

Hanmi Semiconductor is showcasing a range of 2.5D packaging equipment for AI system semiconductors and TC bonders for HBM at a major industry exhibition in Taiwan.

The company is participating in Semicon Taiwan 2026, held in Taipei from Wednesday through Friday. Hanmi has served as an official sponsor of the event for 12 consecutive years, from 2015 through this year.

The exhibition features five 2.5D packaging tools: the FC Bonder 3.5, FC Bonder 75, 2.5D TC Bonder 40 C2S, 2.5D TC Bonder 40 C2W and 2.5D TC Bonder 120. The 2.5D TC Bonder 120 is set for imminent commercial release.

2.5D packaging integrates multiple chips — including GPUs, CPUs and HBM — on a silicon interposer. TSMC's CoWoS is among the most widely cited implementations, and the technology is used in AI semiconductors and high-performance computing.

Hanmi also has a lineup of equipment supporting silicon interposers and substrates up to 350 millimeters by 350 millimeters. On display are the TC Bonder 4, its production tool for HBM4, and the next-generation Wide TC Bonder, designed to accommodate larger DRAM die sizes. The Wide TC Bonder is scheduled for release next year.

Hanmi said it holds the No. 1 position globally in the TC bonder market for HBM. The company plans to expand its equipment business beyond HBM into 2.5D packaging for AI system semiconductors.

Semicon Taiwan is a semiconductor industry exhibition organized by SEMI, the global industry association for semiconductor equipment and materials. This year's event is expected to draw more than 1,300 companies operating 4,300 booths, with attendance projected to exceed 100,000.