Asicland to showcase AxHub platform at TSMC OIP Forum

Asicland, a company specializing in application-specific integrated circuits, said Monday it will participate in TSMC's global Open Innovation Platform Forum, where it plans to showcase its ASIC design and mass production capabilities alongside its proprietary AxHub platform.

The company will exhibit at a dedicated booth at the TSMC 2026 OIP Forum, set for Wednesday (local time) in Santa Clara, California.

This year's event is themed "Expanding AI with Leadership Ecosystem" and will serve as a venue for sharing leading-edge process technologies, advanced packaging, design solutions and collaborative directions within the OIP ecosystem. TSMC customers, OIP partners, and global fabless and semiconductor design professionals are expected to attend.

Asicland plans to use the forum to introduce its ASIC design capabilities and mass production experience to the global semiconductor community. At its booth, the company will present AxHub — its in-house AI-oriented input/output platform — along with its ASIC turnkey solution and silicon reference designs. It also intends to share next-generation process, packaging and AI semiconductor technology roadmaps with global fabless companies and partners, with the aim of broadening long-term technology collaboration.

The ASIC turnkey solution covers the entire semiconductor development cycle — from a customer's initial spec-in stage through back-end design, wafer fabrication, packaging and mass production testing. As the performance and integration density of AI and high-performance computing semiconductors continue to rise, bringing greater design complexity and development burden, the solution is designed to help customers move efficiently from product development through to mass production.

AxHub, developed in-house, is a next-generation AI-oriented I/O platform built to help global fabless companies shorten development timelines and optimize designs. TSMC has highlighted reducing design complexity and cutting development time as key priorities for OIP this year, and Asicland plans to present how AxHub can improve customer development efficiency and accelerate time to market.

The company will also display a physical chip from Fadu, a high-performance semiconductor whose design and mass production Asicland participated in directly. By presenting a tangible reference that connects chip implementation through to volume production, Asicland aims to convey its project execution experience to global semiconductor professionals in a more concrete way.

The approach aligns with the OIP ecosystem's emphasis on shortening product development timelines through proven customer success cases and validated design technologies. Asicland said it will present its design solution capabilities — built on experience in TSMC-process-based ASIC design, verification, manufacturing and mass production support — to help customers advance their product roadmaps.

"As AI semiconductors grow more sophisticated, the ability to reliably connect complex designs all the way through to finished products and mass production is becoming just as critical as leading-edge processes and packaging," a company official said. "Through the TSMC OIP Forum, we will introduce the ASIC design and mass production experience accumulated at our Korean headquarters, along with our proprietary platform capabilities, to global customers, and expand technology exchange with partners across the semiconductor ecosystem."