Hanmi Semiconductor wins W24.48b equipment order from Samsung Electro-Mechanics

Hanmi Semiconductor has secured a 24.48 billion won ($18 million) order for semiconductor back-end equipment from Samsung Electro-Mechanics. Chairman Kwak Dong-shin welcomed the deal, saying the company is "glad to have Samsung Group on board."

Hanmi Semiconductor disclosed Tuesday that it had signed a supply contract with Samsung Electro-Mechanics for large-area Micro Saw & Vision Placement (MSVP) equipment used in manufacturing AI semiconductor substrates.

The contract is valued at 24.48 billion won, equivalent to 4.24 percent of Hanmi Semiconductor's sales of 576.68 billion won last year. The contract runs from Friday through Dec. 17, 2027.

Hanmi Semiconductor plans to coordinate delivery, installation and setup with Samsung Electro-Mechanics' production schedule. The company also intends to assign dedicated after-sales service personnel and vehicles to meet the customer's needs.

The MSVP combines a "micro saw" that precisely cuts semiconductor packages with a "vision placement" unit that washes and dries the cut packages before performing vision inspection, sorting and loading. The equipment is used in processes for DRAM, NAND flash, HBM, system semiconductors, printed circuit boards and glass substrates.

Hanmi Semiconductor launched the first generation of its vision placement system in 1998, sourcing its cutting equipment from Japan's Disco. The company later moved to reduce its supply chain dependence by developing its own technology in-house, completing domestic production of the micro saw in 2021.

The MSVP business has been gaining momentum. Cumulative MSVP sales from January through August this year already surpassed the full-year figure for last year, according to the company. Unit sales this year have exceeded 200, more than double last year's volume, and the company has said it holds the No. 1 position in the global MSVP market.

The scale of Hanmi Semiconductor's disclosed supply contracts has also grown this year. Including Tuesday's deal, the company has announced four supply contracts so far this year totaling 86.2 billion won ($63.4 million), up 39.8 percent from 61.67 billion won in the same period last year.

Hanmi Semiconductor has built its growth around TC bonders for HBM production and is now broadening its back-end equipment portfolio to include MSVP units, 2.5D packaging systems and EMI shielding equipment. The Samsung Electro-Mechanics order also expands the company's customer base beyond global semiconductor makers to include Samsung Group affiliates.

"Hanmi Semiconductor has stably supplied high-precision, high-reliability equipment that customers demand, backed by our in-house core process technology and vertically integrated manufacturing capabilities," Kwak said. "We will focus our efforts on making customer satisfaction our top priority and delivering the core value our customers need."