Chipmaker recognized for stable HBM production support; Q3 sales up 9%, operating profit up 34%
Hanmi Semiconductor, the world's leading maker of thermal compression bonders, has been recognized by SK hynix for its contributions to HBM mass production support.
The two companies are credited with advancing HBM production technology through more than a decade of technical cooperation, helping drive growth in the global AI memory chip market. SK hynix sent Hanmi Semiconductor an award of appreciation on Friday.
Hanmi Semiconductor's TC bonders have served as the primary equipment for producing HBM chips that SK hynix supplies to global AI chipmakers including Nvidia, contributing to SK hynix's dominant position in the global HBM market.
Hanmi Semiconductor operates dedicated offices in Cheongju and Icheon at SK hynix's HBM-exclusive factories, providing close on-site service. The company has also launched a team of skilled semiconductor equipment specialists to respond swiftly to SK hynix's technical requests.
Kwak Dong-shin, chairman of Hanmi Semiconductor, said the company would "continue to strengthen equipment competitiveness in line with next-generation HBM technology development and contribute to the advancement of the global semiconductor industry."
Meanwhile, Hanmi Semiconductor reported third-quarter sales of 181 billion won ($136 million) and operating profit of 90.8 billion won, up 8.9 percent and 33.9 percent, respectively, from the same period a year earlier.
The operating profit margin for the quarter reached 50.2 percent, up 9.4 percentage points from 40.8 percent a year ago. The company said the figure reflects both its technological competitiveness and the high added value of AI semiconductor packaging equipment.
"Following record-high sales in 2024 and 2025, we expect this year to mark another all-time high," the company said. "Next year, we anticipate growth momentum to accelerate further, with earnings setting new records."
freiheit@heraldcorp.com
