Samsung Electro-Mechanics to invest W4.27tr in Sejong package substrate facility

Samsung Electro-Mechanics will commit more than 4 trillion won ($2.96 billion) to expanding its production capacity for high-value semiconductor package substrates for AI applications.

The company disclosed Monday that it will invest 4.27 trillion won to scale up its package substrate production facility at its Sejong plant, according to Yonhap.

The amount represents 43.6 percent of the company's equity based on its consolidated financial statements at the end of last year. The investment period runs from Monday through May 31, 2028.

Through the investment, Samsung Electro-Mechanics plans to expand its production capacity for flip-chip ball grid array (FC-BGA) substrates, a high-value semiconductor package substrate used in AI servers.