LG Innotek executive receives Silver Tower Order of Industrial Service Merit at electronics industry ceremony

LG Innotek announced Tuesday that Cho Ji-tae, executive vice president and head of its Package Solution Division, received the Silver Tower Order of Industrial Service Merit at the 21st Electronics and IT Day ceremony at COEX in Seoul's Samseong-dong.

Cho was recognized for strengthening national industrial competitiveness by building globally top-ranked materials and components businesses, leading AI-driven production innovation, and advancing the localization of manufacturing equipment.

He also contributed to cumulative exports of 80 trillion won ($59.8 billion) from 2021 through last year, spanning roles across the Optical Solution and Package Solution divisions. Those contributions were cited as the basis for his selection as this year's Silver Tower honoree.

Cho joined LG Innotek in 2004 and has built a reputation as a production specialist and yield expert who raised the quality and manufacturing competitiveness of the company's core businesses to world-class levels.

He began leading the company's Vietnam production subsidiary in 2017, subsequently overseeing optical solution manufacturing operations before serving as head of the Optical Solution Division through last year.

Cho was particularly instrumental in driving AI-based production innovation for mobile camera modules. A standout example was the integration of AI across the entire process — from development to mass production — to establish an automated quality inspection and improvement system. Building on that AI-driven production transformation, he pushed yields to the industry's highest levels and maintained the camera module business's position as the global No. 1. LG Innotek's mobile camera module sales last year were more than 30 times their 2010 level, when smartphones were in their early days.

Late last year, Cho was appointed head of the Package Solution Division, which leads the company's semiconductor substrate business — another key growth pillar. He was tapped to simultaneously drive production line scale-up and yield stabilization as demand for high-value-added semiconductor substrates surges in the AI era.

LG Innotek holds high-value-added semiconductor substrate products — including RF-SiP (Radio-Frequency System in Package) and FC-CSP (Flip Chip-Chip Scale Package) — that rank No. 1 in global market share. The company is also aggressively pushing to expand its FC-BGA (Flip Chip-Ball Grid Array) substrate business as a new growth venture.

To widen the technology gap in semiconductor substrates and strengthen business competitiveness, Cho is pursuing a large-scale investment to more than double the company's semiconductor substrate production capacity. He recently announced a goal of growing the Package Solution business into a 1 trillion won operating profit business within five years.

"I am honored to accept this award on behalf of all LG Innotek employees who have poured their passion and effort into securing differentiated technology and business competitiveness, and I feel the weight of a great responsibility," Cho said. "I will do everything in my power to ensure LG Innotek continues to grow as a global electronics and IT company representing South Korea."