Hanmi Semiconductor posts record quarterly sales of W251.1b, operating margin hits all-time high

Hanmi Semiconductor has set another quarterly earnings record, riding the wave of surging investment in high-bandwidth memory. Growing demand for AI semiconductors has pushed global memory makers to expand their capital spending, lifting sales of the company's TC bonder and MSVP equipment in tandem.

The company disclosed Tuesday that it posted consolidated sales of 251.1 billion won ($167 million) and operating profit of 130.3 billion won in the second quarter of 2026. Sales rose 39.5 percent year-on-year and operating profit climbed 51.0 percent. The operating profit margin reached 51.9 percent, a new quarterly record.

The results were driven by surging demand for TC bonder equipment used in HBM production. TC bonders are critical tools in the HBM stacking process and are directly tied to output volumes. The world's three major memory chipmakers are aggressively expanding their HBM capacity to meet demand from AI server customers, according to industry sources.

Hanmi Semiconductor holds the No. 1 global market share in TC bonders, according to industry assessments. As key customers have moved into full-scale mass production of HBM4, new equipment shipments have increased, and expectations are growing for additional orders ahead of the transition to HBM4E at year-end and in early next year.

Expanding global investment is also creating a favorable order environment. Micron is pressing ahead with HBM packaging capacity expansions in Singapore, Idaho and New York, following its acquisitions of AUO and PSMC facilities in Taiwan. The US chipmaker has also announced investment plans in Hiroshima, Japan, accelerating the buildout of its related supply chain.

MSVP equipment also contributed to the strong results. The MSVP handles back-end processes including dicing, cleaning, inspection and loading. Demand has been rising as panel-level packaging gains wider adoption in AI semiconductor packaging.

Hanmi Semiconductor is also accelerating next-generation product development. The company plans to unveil a prototype of its second-generation hybrid bonder by year-end and launch a wide TC bonder in the first half of next year. Both moves are preemptive investments aimed at the next-generation HBM market, where stacking of 16 or more layers is anticipated.

The company is also diversifying its product portfolio by supplying three types of 2.5D packaging equipment to global foundry and OSAT customers. The 2.5D TC Bonder 40, FC Bonder 3.5 and FC Bonder 75 are each specialized for chip-on-wafer and wafer-on-substrate processes.

Industry observers expect AI demand to persist for the foreseeable future, pointing to sustained expansion in HBM-related equipment investment over the medium to long term. However, the timing of equipment orders remains a variable, subject to shifts in memory market conditions and customer investment cycles.

"We plan to accelerate the supply of our new 2.5D packaging equipment in line with recent shifts in AI semiconductor trends," the company said. "We will sustain our consistent growth by delivering advanced, tailored equipment to the increasingly sophisticated AI packaging market at the right time."