Toss Securities publishes research note on Semicon Taiwan 2026, pledges expansion of on-site research

Toss Securities' Research Center announced Thursday that it has published a research note capturing industry trends and investment implications observed firsthand at Semicon Taiwan 2026 in Taipei.

The report highlights that competition in AI semiconductors is expanding beyond the performance of individual chips to encompass the broader semiconductor ecosystem, including packaging, data movement, power and production efficiency.

The center identified four key technology trends: the platformization of advanced packaging, the growing importance of inspection, testing, laser and materials as packaging becomes more sophisticated, the rise of technologies addressing data-movement and power bottlenecks, and the incorporation of smart fabs and green fabs into semiconductor capital expenditure.

The Research Center said bottlenecks in the AI semiconductor industry are likely to become distributed across multiple stages rather than concentrated in any single technology or process. It added that as these shifts continue, the role and importance of materials, components and equipment companies within the semiconductor ecosystem will grow accordingly.

"As the semiconductor industry rapidly restructures around AI, the investment opportunities worth watching are also broadening across the entire industry," said Lee Young-gon, head of Toss Securities' Research Center. "We will consistently expand our on-site research to directly verify industry changes that are difficult to read from data alone, helping investors discover new opportunities more quickly."

In June, Toss Securities published a research note based on exchanges with local investors, analysts and corporate officials in San Diego and Las Vegas. In March, the firm visited GTC (GPU Technology Conference) 2026, the world's largest AI developer conference, to deliver on-the-ground insights to investors.