Hanmi Semiconductor ships first FC Bonder 75 for AI system chip packaging

Hanmi Semiconductor said Tuesday it has shipped its first FC Bonder 75 — a 2.5D packaging equipment for AI semiconductors — to a global customer. The move marks the company's push into the AI system chip packaging equipment market, expanding beyond its core TC Bonder lineup for HBM.

The FC Bonder 75 supports large interposer packaging measuring 75mm by 75mm, a significant step up from the 20mm-by-20mm size common in conventional general-purpose semiconductor packaging. Demand for equipment capable of handling large interposers has grown as the industry increasingly integrates multiple chips — including CPUs, GPUs and HBM — into a single package for AI applications.

2.5D packaging places multiple chips side by side on an intermediate substrate called an interposer. TSMC's chip-on-wafer-on-substrate, or CoWoS, is the leading example. TSMC bundles a system-on-chip and HBM into a single package through CoWoS and has said demand for the technology surged after the spread of generative AI. The company is also producing CoWoS at 5.5 times the reticle size this year.

Hanmi Semiconductor has been rapidly expanding its AI system chip equipment lineup this year. The company has released the FC Bonder 3.5, the 2.5D TC Bonder 40 C2S and the 2.5D TC Bonder 40 C2W, and plans to launch the 2.5D TC Bonder 120, which targets even larger packages.

The company has formally designated 2.5D packaging as a new growth market beyond HBM. In its "2026 Corporate Value Enhancement Plan" disclosed in July, Hanmi Semiconductor said it would enter the 2.5D packaging market for AI system chips through the launch of its 2.5D TC Bonder series. The strategy is to broaden its equipment portfolio — previously concentrated on HBM TC Bonders — into AI system chip packaging.

Hanmi Semiconductor is also pursuing US expansion. The company has been working toward establishing a US subsidiary in the second half of this year, and said in a press release that it plans to set up Hanmi USA in October. The subsidiary will target local equipment demand from US AI chip designers, foundries and outsourced semiconductor assembly and test, or OSAT, providers. As of its first-quarter report, the company's major customers include SK hynix, Micron, ASE, Amkor and JCET.

"Starting with the first shipment of the FC Bonder 75, we are expanding our technological competitiveness in the AI semiconductor market by supplying customers not only with TC Bonders for HBM but also with TC Bonders for AI packages and a range of other packaging equipment," a company official said. "Through this, we will achieve sustained sales growth."