Chey Tae-won attends GTC Taipei keynote, deepening ties with Nvidia's Jensen Huang

SK Group Chairman Chey Tae-won attended Nvidia's GTC Taipei 2026 conference, continuing to build his relationship with Nvidia CEO Jensen Huang after previously attending the GTC event in San Jose. The two have now met officially three times in the past seven months, reinforcing their companies' deepening cooperation.

On Sunday local time, Chey attended the GTC Taipei 2026 keynote alongside SK Hynix CEO Kwak Noh-jung, SK Hynix AI Infrastructure President Kim Ju-sun and SK Hynix Global Sales and Marketing Vice President Lee Sang-rak.

Chey followed the keynote closely throughout, using the occasion to assess firsthand what role SK Hynix should play as the AI ecosystem undergoes rapid transformation.

Analysts said the visit reinforced Chey's strategic direction: strengthening partnerships with key customers centered on HBM while proactively securing next-generation memory chip technology, positioning SK Hynix as an "innovation partner" in jointly shaping the next AI architecture.

In his keynote, Huang outlined the evolution of GPU-based accelerated computing and the latest trends in AI technology. He also unveiled the mass production roadmap for Vera Rubin, Nvidia's next-generation AI platform, and detailed the company's collaboration with Asia-Pacific partners.

Huang officially announced that Vera Rubin "has entered full production," and went on to say that it incorporates TSMC's 3-nanometer process, advanced packaging, and HBM4 from Micron, SK Hynix and Samsung Electronics.

Huang also presented business results in physical AI — including self-driving cars and industrial robots — along with strategies for building out AI factories and an open-source AI model ecosystem. SK Hynix was cited as an example of an AI factory.

Chey has been steadily expanding his personal engagement with Huang. The two met in Silicon Valley in February to discuss AI infrastructure cooperation, then again at GTC 2026 in San Jose in March, where they worked to define the scope of their collaboration.

An SK Hynix official said the company plans to present its "Full-Stack AI Memory Creator" vision to major global customers during the trip.

The strategy centers on delivering integrated solutions spanning customized HBM — known as cHBM — as well as DRAM and NAND, with the aim of boosting AI system performance and power efficiency at the same time.

In addition, SK Hynix is accelerating development of next-generation products that combine memory and logic technology, starting with HBM4.

The company plans to expand into next-generation technologies including HBF (high-bandwidth flash memory) and 3D Stacked DRAM on Logic, positioning itself to meet demand from AI data centers and the on-device AI market ahead of the curve.

As AI becomes core infrastructure across industries, the strategic importance of memory semiconductors continues to grow. Chey's repeated visits to major global AI events reflect his determination to gain a competitive edge in the AI era by deepening cooperation with Nvidia and other leading technology companies.