Company aims to secure over 100 researchers by next year
Samsung Electronics has opened an advanced packaging research lab in Yokohama, Japan, with plans to invest 350 billion won ($261 million) over five years to secure high-value-added chip technology.
According to industry sources and foreign media, Samsung Electronics held the opening ceremony for its Advanced Package Lab in Yokohama's Minato Mirai district Tuesday. About 100 people attended, including Jun Young-hyun, vice chairman of Samsung Electronics' Device Solutions Division, along with officials from the Japanese government, local authorities and partner companies.
Samsung plans to invest 40 billion yen ($260 million) in the lab from 2024 through 2028 to develop advanced packaging technology. The company aims to secure more than 100 researchers by 2027.
Advanced packaging is a back-end process technology that integrates semiconductors such as AI accelerators and high-bandwidth memory into a single package. As ultra-fine process technology nears its limits, packaging has become a key factor determining the performance of AI chips.
Samsung chose Yokohama for the lab because the location offers an advantage in securing talent. The city is close to the University of Tokyo, Yokohama National University, and global semiconductor materials, parts and equipment companies such as Resonac and Disco. This proximity gives Samsung an edge in recruiting researchers for chip technology development.
Samsung plans to position the Advanced Package Lab as a global research and development hub for next-generation packaging technology and to strengthen cooperation with local materials, parts and equipment companies.
yeongdai@heraldcorp.com
